
Salario por hora:A petición
Experiencia laboral total:8 años
Situación profesional actual: Trabajador independiente
Ubicación: Bangalore, IN
Disponibilidad para viajar: Lugar de residencia del freelancer
Expertise to work with High speed interfaces up to 12 Gbps. Hands on experience to work with highly complex network computing Mother boards which include the high speed interfaces like DDR4,DDR3,PCIE,SATA,SDRAM,HDMI,USB3.0,WiFi, CSI,FPC,SPI,PowerJacks, SD cards, and Bluetooth Devices Involved in Multilayer High-Speed Board design up to 12 Layers. Footprint Creation including short pitched BGAs. Experience to handle 0.5MM, 0.4MM pitch BGAs with Blind and buried via techniques, HDI Micro via (Stacked and staggered micro vias) and Back drilling techniques. Advanced knowledge of constraints and use of the constraint manager. Complete floor plan to design PCBs include Placement, Controlled impedance traces routing, layers identification, Isolation, AGND & DGND separations, EMI, EMC, Shield cages, Heat sink and Airflow directions. Have good knowledge in Differential pairs, DDR, shield, high speed, RF signal routing, Power supply, Arc routing and serpentine routing. Experience in Net, Pin pair and combination-net (X-nets) length matching and pin delay matching. Experience in Design for EMI/EMC and Compliance Standards. Accustomed to designing PCB's with a high awareness of “Design for Manufacturing, Assembly, and Test” requirements. Experience in analog, digital and mixed signal circuit design. Experience in CAM setup, Gerber generation and validation. Education: College/University in Engineering